| 摘要 |
In a method of making a double-sided thick-film integrated circuit, patterns of a liquid conductive substance or ink is applied to opposite sides of a thick-film substrate by a conventional screen printing technique. In order to obtain short conductive interconnections between the printed patterns at selected points, through holes or bores are provided in the substrate prior to printing. Each bore or hole is provided with at least one end portion merging into a gorge or throat. The widened end portion allows filling of the hole or opening and establishing of the desired conductive interconnection without use of vacuum. Through holes or openings with a widened end portion or portions may be provided in a thick-film substrate of ceramic material before firing and hardening of the material. |
