A MICROELECTRONICS APPARATUS AND METHOD OF INTERCONNECTING WIRING PLANES

摘要

A method of fabricating customized connections between wiring planes of microelectronics apparatus is disclosed. Hence, a first wiring plane (10) having multiple conductors (11) is formed upon a substrate (S). An insulating layer (20) is formed that overlies and electrically insulates the first wiring plane. A second wiring plane (30) having multiple conductors is formed above the unsulating layer (20) by forming multiple conductors (31) that are electrically connected to the first wiring plane with selected conductors (11) of the first wiring plane being electrically connected to selected conductors (31) of the second wiring plane. The connections may be modified by breaking (at 40) selected ones of the electrical connections between the first and second wiring planes to customize the electrical interconnections.