| 摘要 |
PURPOSE:To improve the reliability of interconnection by substantially completely flattening the stepwise difference of a lower interconnection layer by means of an interlayer insulating layer to eliminate the difference due to multilayer interconnections. CONSTITUTION:A substrate 1 having a patterned interconnection layer 2 is covered with a solution of a polyamic acid ester oligomer obtained by reacting aromatic tetracarboxylic acid ester obtained by reacting aromatic tetracarboxylic acid bianhydride and alcohol and/or alcohol derivative with aromatic diamine and/or diaminosiloxane. The solution is cured to form an interlayer insulating film 5, and a throughhole is formed. Thereafter, an upper interconnection layer 4 is formed on the film 5. Thus, a stepwise difference due to multilayer interconnections is eliminated to improve the reliability of interconnections.
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