发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain a positive type photosensitive resin composition employing an alkaline development system, high in sensitivity and resolution, and superior in oxygen plasma resistance by using an alkali-soluble organometallic polymer and a photosensitive dissolution inhibitor as essential components. CONSTITUTION:The alkali-soluble organometallic polymer is converted into a metal oxide film acting as the film resistant to the oxygen plasma. The other essential component of the photosensitive dissolution inhibitor hinders the alkali dissolution of said polymer in unexposed areas and on the other hand, in the exposed areas, it loses the effect of inhibiting the dissolution of said polymer as the result of photoreaction, permitting the exposed areas of the polymer to dissolve in an alkali developing solution. Consequently, the positive type photoresist superior in oxygen plasma resistance, and high in sensitivity and resolution to be obtained by using the combination of these 2 essential components.
申请公布号 JPS62159141(A) 申请公布日期 1987.07.15
申请号 JP19860000501 申请日期 1986.01.08
申请人 HITACHI LTD 发明人 SUGIYAMA HISASHI;NATE KAZUO;INOUE TAKASHI;MIZUSHIMA AKIKO
分类号 G03C1/72;G03C1/00;G03C1/675;G03F7/022;G03F7/039;G03F7/075;G03F7/11;G03F7/26;H01L21/027 主分类号 G03C1/72
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