发明名称 A PROCESS AND APPARATUS FOR ELECTROPLATING COPPER FOIL
摘要 The present invention involves a process and associated apparatus for producing surface treated metal foil, comprising: providing an electrolytic cell having an electrolyte and a cathodic surface immersed in the electrolyte, the electrolyte containing a concentration of matel ions; applying a first current density in a frist zone for plating a relatively smooth metal foil deposit on the cathodic surface; and applying a pulsed second current density having a magnitude greater than the limiting current density in a subsequent second zone, the pulsed second current density forming a plurality of self adhering nodules on the base metal deposit.
申请公布号 AU6898187(A) 申请公布日期 1987.07.15
申请号 AU19870068981 申请日期 1986.12.23
申请人 GOULD INC., 发明人 BETTY M. LUCE;BETTY L. BERDAN
分类号 C25D1/04;C25D;C25D17/00;H05K3/24;H05K3/38 主分类号 C25D1/04
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