| 摘要 |
PURPOSE:To enable a semiconductor device to be inexpensively manufactured, by coupling an IC chip, a soldering bump, and conductors through bonding wires which are formed by coating a core material of high-purity copper with solder plating. CONSTITUTION:Conductors 8 are connected with an IC chip 10 through bonding wires 12, to couple the IC chip 10 and a lead pin 5. The bonding wires 12 are formed by coating a core material 12a, which is trimmed into a Cu wire of 30X in diameter by repeating wire-drawing processes and intermediate heat treatment of the high-purity copper, with solder plating 3. And, they are made to adhere to bonding leads 8a of the conductors 8 and the soldering bump 9 of the IC chip 10 by thermal pressing or supersonic bonding method or the like. Because the conductors 8 and the bonding wires 12 are coated with the solder plating 3 in this way and besides the soldering bump 9 is also formed on the side of the IC chip 10, adhesion strength of the bonding wires is further enhanced. |
