| 摘要 |
PURPOSE:To simply and easily connect chip-type electronic parts with wiring patters, by forming contact holes at resinous films composed on a resinous substrate and besides providing the surface of the resinous films with the wiring patterns which are connected with the terminal electrodes of the chip-type electronic parts through the contact holes. CONSTITUTION:Contact holes 4a... are formed at appointed positions of resinous films 4, and electrode pads/terminals 3a and 3a in respective electronic parts 2 and 3 are made to be exposed outside. Then, a conductive thin film 5' is formed on a surface (an upper plane) of a resinous substrate 1 so that one part of the thin film 5' passes through the contact holes 4a... of the resinous films 4 to be in direct contact with the electrode pads/terminals 3a and 3a in the respective electronic parts 2 and 3 and to have continuity with them. And, the conductive thin film 5' is formed on prescribed wiring patterns 5 by photo-lithographic method. In this case, not only the patterns for drawing out the electrode pads/terminals 3a and 3a in the respective electronic parts 2 and 3, but also all of the wiring patterns are formed on the resinous films 4. |
