| 摘要 |
PURPOSE:To enable a reserving adhesive to be removed by a surface protecting tape on a semiconductor substrate without using fuming nitric acid, by coating a surface of a semiconductor substrate with a thin film and sticking the surface protecting tape on the surface through the thin film. CONSTITUTION:After a surface protecting tape 13 made of polyester or the like, with an adhesive sticked on its one-sided surface, is sticked through a photo-resist film 12 on a surface of a semiconductor substrate 11, the back surface of the semiconductor substrate 11 is ground to given thickness. When the surface protecting tape 13 sticking on the surface is peeled, an adhesive 15 on the surface protecting tape 13 is left on the surface of the photo-resist film 12 formed on the surface of the semiconductor substrate 11. Finally, the photo-resist film 12 is removed from the substrate 11 by an organic solvent. Thus, the adhesive 15 of the surface protecting tape, which is left on the surface of the photo-resist film 12, is also removed together with the photo-resist film 12 from the semiconductor substrate 11.
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