发明名称 LASER ASSISTED ETCHING METHOD
摘要 PURPOSE:To realize a process of photo-etching with effect in a low temperature process, by irradiating a photo-excitable etched object with pulsed laser light which is much smaller in pulse width than a collision time constant of an active core gas under gaseous pressure in the system to the etched object surface. CONSTITUTION:A reaction chamber 20 is filled with an active core gas for etching, and the active core is absorbed in high density on a surface of an etched object 18 located inside the reaction chamber. And, in a state in which the active core is absorbed on the etched object, pulsed laser light 16, which is much smaller in pulse width than a collision time constant of the gas under gaseous pressure in the system to the etched object surface, is radiated. Thus, because a non-thermal chemical reaction of photo-excitation is promoted between the active core and the etched object, photo etching can be performed with high etching efficiency.
申请公布号 JPS62158331(A) 申请公布日期 1987.07.14
申请号 JP19860000032 申请日期 1986.01.06
申请人 OKI ELECTRIC IND CO LTD 发明人 IKEGAMI NAOKATSU
分类号 H01L21/302 主分类号 H01L21/302
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