| 摘要 |
A connector for an IC package has a connector body, an IC package accommodation compartment formed in the connector body, a peripheral wall defining the compartment, and a plurality of partition walls projecting from the inside surface of the peripheral wall toward the compartment at regular intervals and extending from the upper surface of the peripheral wall toward the bottom of the compartment to define contact accommodation grooves. A plurality of contacts corresponding in number to IC leads of the IC package are accommodated within the grooves and are isolated from one another by the partition walls. Each contact is formed of a resilient contact piece having a planted part implanted in the connector body, a male terminal projecting from the bottom of the connector body and a leading part rising from the printed part and slanting toward the compartment. The leading part has an engaging part bent toward the compartment and is resiliently displaced in a direction away from the compartment by a bent part of the IC lead when the IC package is inserted into the compartment. When the IC package has been set in position relative to the connector body, the leading part is returned toward its original position while still having a resilient force biasing itself to its original position. The engaging part remains in resilient contact with the IC lead at a shoulder part of the IC lead.
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