发明名称 ION PLATING DEVICE
摘要 PURPOSE:To subject a long-sized material to be treated to ion plating of uniform film quality and film thickness at a low cost by moving plural vapor sources which are spaced from each other and are provided on a moving frame in the longitudinal direction of the material to be treated in a vacuum vessel. CONSTITUTION:Electron rays are irradiated from electron guns 1 to the vapor sources 3 to evaporate and ionize raw materials 4 for vapor deposition in the vacuum vessel 7 and the ionized evaporating materials generated by such irradiation are coated on the surface of the material 5 to be treated to which the voltage from a DC power source 2 is impressed. The moving frame 12 which is freely movable along the longitudinal direction of the material 5 to be treated and a cylinder 8 which drives the frame are disposed in the vacuum vessel of the ion plating device constituted in the above-mentioned manner. The plural vapor sources 3, 3 which are spaced from each other along the moving direction are provided on the above-mentioned moving frame 12 in such a manner conditions. Vapor deposition is executed while the above-mentioned vapor sources 3 are moved and the uniform ion plating is made possible with the compact and simple device.
申请公布号 JPS62158861(A) 申请公布日期 1987.07.14
申请号 JP19850299536 申请日期 1985.12.28
申请人 ISHIKAWAJIMA HARIMA HEAVY IND CO LTD 发明人 OKABE SHUICHI;SHINOHARA JOSHI
分类号 C23C14/32 主分类号 C23C14/32
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