| 摘要 |
PURPOSE:To accommodate the titled material to various circuit conditions and to prevent abnormal consumption due to layered deposits, breakage, etc., by dispersing into Ag specific amounts of Sb oxide, respective oxides of Cu, Zn, and Mn, Sn oxide, and Te oxide. CONSTITUTION:Sb oxide with 0.1-6.2wt% metallic component, one or more kinds among oxides of Cu, Zn, and Mn with 0.05-5wt% metallic component, Sn oxide with 0.05-5wt% metallic component, and Te oxide with 0.01-2wt% metallic component are dispersed into Ag as a principal component. Further, one or more kinds among oxides of Fe, Ni, and Co with 0.01-0.5wt% metallic component are dispersed, if necessary. This silver-oxide type contact point material is minimized in layered deposit content owing to the effect produced by combined addition of Sb and Te, and further, it has characteristics such as reduction in arc consumption, etc. |
