| 摘要 |
PURPOSE:To improve adhesive strength of dry plating, by subjecting a metallic substrate to ion bombardment by use of inert gas and then to ion bombardment by use of hydrogen gas. CONSTITUTION:Prior to the application of dry plating to the metallic substrate of copper (alloy), etc., ion bombardment is first applied by use of inert gas such as argon gas, etc., so as to remove adsorbates on the oxides at the substrate surface, such as oil, dust, etc., followed by ion bombardment by use of hydrogen gas, so that adsorbate-free oxides at the substrate surface are removed by reduction and the metallic-substrate surface is provided with high cleanliness. According to the above method, adhesive strength between the dry-plated film and substrate can be improved by means of short-time treatment without causing distortion in the substrate.
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