| 摘要 |
<p>The present invention provides a method of manufacture of contact switches having conductive coatings of increased adhesive strength and resolution for producing through-contacts in boreholes of printed circuit boards, comprising the steps of providing a base material, drilling boreholes in said material, cleaning, activating and reducing said base and producing a coating thereon, and heating-up said base material at temperatures within the range from 100.degree.C to 150.degree.C immediately after said reducing step, said heating-up step being carried out for from 5 minutes to 2 hours, said reducing step being carried out by means of a reducing agent selected from the group consisting of alkaline hypophosphite, sodium borohydride and dimethyl-amino-boron.</p> |
