发明名称 THERMOPLASTIC RESIN COMPOSITION FOR USE IN SEALING ELECTRONIC COMPONENT
摘要 PURPOSE:To provide the titled compsn. having excellent sealing moldability and moisture resistance, by blending a specified polyphenylene sulfide with a fibrous filler, an epoxysilane and silica. CONSTITUTION:35-50wt% polyphenylene sulfide (A) having a melt flow index of 2,000g/10min or above, composed of at least 70mol% of a repeating unit of formula I and less than 30mol% of repeating units of formulas III, IV, V, VI, VII and VIII is blended with 8-30wt% fibrous filler (B) having a fiber length of 0.03-1.0mm (e.g., glass fiber) after kneading and extrusion, 0.3-3wt% epoxysilane (C) (e.g., gamma-glycidoxypropoyltrimethoxysilane) and 30-65wt% fused and/or crystalline silica (D).
申请公布号 JPS62158754(A) 申请公布日期 1987.07.14
申请号 JP19860000803 申请日期 1986.01.08
申请人 TORAY IND INC 发明人 YOSHIOKA AKIRA;KOBAYASHI HIROKAZU;KISHIMOTO AKIHIKO
分类号 H01L23/29;C08K3/36;C08K5/54;C08K7/02;C08K13/04;C08L81/02;C09K3/10;H01L23/31 主分类号 H01L23/29
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