| 摘要 |
PURPOSE:To enable a small-size thermal head chip to be formed without reducing the number of heating dots and to be disposed approximately twice the quantity on the same-size insulating substrate compared with the prior art, by a method wherein the thermal head chip is formed triangular and provided with; a feeder layer supplying power to a plurality of heating resistor layers linearly disposed on a glazing layer on the insulating substrate, and a protective layer. CONSTITUTION:On a partial glazing layer 12 formed closely to division lines 15 on an insulating substrate 1, a plurality of heating resistor layers 13 are linearly disposed. Separate lead electrodes 14b are pulled out while being bent so as to be contained within a triangle inside a diagonal 17. On the other hand, a feeder layer 14 is in conductive contact with terminal portions 16, shown by a division line A-A, for connecting to external circuits. Even if the partial glazing layer 12 as well as the heating resistor layers 13 are divided by the diagonal 17, a sufficient space and the arrangement of the same width as that in the prior art in the terminal portions 16 can be provided by using a real edge type. |
