发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain the titled composition having improved sensitivity and surface hardness of a coating film by incorporating a specific compd., a compd. contg. at least one of an epoxy group, a compd. capable of addition polymerization having at least two end ethylenic unsatd. groups and a photoinitiator capable of forming a free radical by an activating ray or a sensitizer to the titled composition. CONSTITUTION:The titled composition contains the compd. shown by the formula, the compd. contg. at least one of the epoxy group, the compd. capable of the additional polymerization having at least two end-ethylenic unsatd. compd. and the photoinitiator capable of forming the free radical by the activiting ray or the sensitizer. As the compd. having at least one of the epoxy group, a novolak type epoxy resin is preferably to use. The prescribed compd. is used 0.1-5wt%, preferably 0.5-2.0% on the weight basis of the compd. shown by the formula. The addition polymerizable compd. having at least two end-ethylenic unsatd. groups is composed of a monomer, a dimer and a trimer, etc., which have the ethylenically unsatd. double bond, and cures by an action of a photodecomposition product of the photopolymerization initiator in case of radiating the active ray to the photosensitive composition resulted in making insoluble it.
申请公布号 JPS62157029(A) 申请公布日期 1987.07.13
申请号 JP19850298264 申请日期 1985.12.28
申请人 UNITIKA LTD 发明人 IWAYA YOSHIAKI;IMAZU HIDEKI;HIOKI MASANOBU
分类号 G03F7/038;(IPC1-7):G03C1/68;G03C1/68 主分类号 G03F7/038
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