发明名称 HEAT-RESISTANT RESIN COMPOSITION
摘要 PURPOSE:To obtain the titled composition capable of high-speed baking in a short time, for use in enameled copper wires, by blending a specific polyamidimide resin and either aromatic diisocyanate blocked with lactum or trimer therefrom in specified proportion. CONSTITUTION:The objective composition can be obtained by blending (A) 100pts.wt. of a polyamidimide resin prepared by reaction, in a polar solvent, between (i) a tribasic acid anhydride (e.g. trimellitic anhydride) and (ii) an aromatic diisocyanate (e.g. 4,4'-diphenylmethane diisocyanate), if needed, together with tetrabasic acid dianhydride in a molar ratio (i)/(ii) of 0.9-1.10 so that the reduced viscosity of the resulting resin (determined in the form of dimethyl formaide solution with a solid content 0.5g/dl) falls between 0.20 and 0.35 and (B) 1-10pts.wt. of an aromatic diisocyanate blocked with lactum or trimer therefrom.
申请公布号 JPS62156122(A) 申请公布日期 1987.07.11
申请号 JP19850299318 申请日期 1985.12.27
申请人 HITACHI CHEM CO LTD 发明人 OSADA YUICHI
分类号 C08G18/34 主分类号 C08G18/34
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