| 摘要 |
PURPOSE:To improve heat-dissipating properties, to prevent the deterioration of characteristics due to heat and to enhance operating efficiency by forming a stepped section to the back of a wiring substrate and fitting input/output terminals onto the lower surface of the back. CONSTITUTION:Stepped sections where oppositely faced side edge sections 7 along long sides are each lowered and a central section 8 is heightened are shaped to the back of a wiring substrate 5. The height of the stepped section, the difference of the height of the side edge section 7 and the central section 8, is made the same as the thickness of input-output terminals mentioned below or higher than that. A plurality of conductor pads 9 for mounting the input- output terminals are formed respectively at regular intervals on the side edge sections 7 on the lower sides of the stepped sections, and the input/output terminals 10 are each fixed through silver soldering in parallel with the back of the wiring substrate 5, directing nose sections thereof outward to these conductor pads 9 for fitting the input/output terminals. The whole central section 8 of the back having a wide area is brought into contact with a surface to be loaded, thus resulting in an easy escape from the wide heating surface of heat generated in the hybrid integrated circuit.
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