发明名称 DIE BONDING DEVICE
摘要 PURPOSE:To make the position of bonding more accurate by forming an optical guideway penetrating an attraction collet so that a TV camera can photograph the patterns of at least two positions on the surface of a semiconductor die and obtaining the angle of slippage on the basis of the result of the recognition of the patterns regarding two positions. CONSTITUTION:A semiconductor die 2 is sucked to a vacuum collet 3. Luminous flux L is reflected by a half mirror 6, and lightens two positions on the surface of the die 2. When the collet 3 is moved in the directions of an X-axis and a Y-axis and each optical path 16, 16' reaches where corresponding to a TV camera 90, a pattern on the surface is photographed by the TV camera. When the position of the image of the pattern coincides with the standard position of the pattern, each relative movement to the TV camera of the collet 3 up to that time is arithmetically operated. The quantity of slippage and angle of slippage of the position of attraction of the die 2 to the collet 3 are arithmetically operated on the basis of these two relative movement. Movement and the angle of rotation are corrected so as to deny said quantity of slippage and angle of slippage during a time when the die 3 is shifted up to a bonding section.
申请公布号 JPS62155530(A) 申请公布日期 1987.07.10
申请号 JP19850296010 申请日期 1985.12.27
申请人 TOSHIBA CORP 发明人 KOBAYASHI HIROAKI
分类号 H01L21/52;H01L21/58;H01L21/67;H01L21/677;H01L21/68 主分类号 H01L21/52
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