| 摘要 |
<p>PURPOSE:To miniaturize the titled module, and to use it in a wide field by superposing a substrate, on which a plurality of microcomputer circuits are loaded and which has input/output terminals, and a substrate, on which a plurality of memory circuits are loaded and which has input/output terminals, and housing both substrates in a case under the state in which the input/output terminals on the substrate are connected electrically to the other substrate and input/output terminals on the other substrate are exposed. CONSTITUTION:A plurality of input/output terminals 14, 14...14 are protruded in the vertical direction to the back of a substrate 13 on which memory circuits 12 are loaded, and a plurality of through-holes 15, 15...15 are formed to the peripheral section of the surface of the back. A plurality of input/output terminals 16, 16...16 are shaped in a projecting manner in response to the through-holes 15 for the substrate 13 to the back of a substrate 11 on which microcomputer circuits 10 are loaded. These both substrates 11, 13 are connected electrically and mechanically by each inserting the input/output terminals 16 for the substrate 11 into the through-holes 15 for the substrate 13 and soldering the input/output terminals 16 and the through-holes 15.</p> |
