| 摘要 |
PURPOSE:To obtain the title cured product excellent in strength and modulus without sacrificing elongation, by mixing a specified additive for epoxy resin with an epoxy resin and a curing agent (cure accelerator), curing the obtained mixture and slowly cooling the cured product from its glass transition temperature to room temperature. CONSTITUTION:A low-molecular epoxy compound of formula I [wherein R3-4 are ach H or a 1-17 C (un)saturated aliphatic, aromatic or heterocyclic group which may be substituted with a halogen, nitro, alkoxy, allyloxy or acetyl] is reacted with at least one compound selected from those of formulas II-IV (wherein R1-2, R5-6, R9-10 and R13 are each R3 or R4 X is O, S, = N-R4 and R14 is R3 or R4) at room temperature to 180 deg.C and an epoxy group to NH group ratio of 1-5/5-1 to obtain an additive (B) for epoxy resin, of formula V, VI or VII (wherein R7-8 and R11-12 are R3 or R4). 100 pts. wt. resin composi tion (A) comprising an epoxy resin and a curing agent (cure accelerator) is mixed with 2-150 pts. wt. component B, the mixture is cured and the cured product is slowly cooled from its glass transition temperature to room tempera ture at a rate of 2 deg.C/min or above.
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