| 摘要 |
<p>An integrated circuit device having a chip comprises : cell arrays consisting of a plurality of cells, the cells comprising impurity introduction regions (l5, l7) respectively, and conductive lines (VSS, VDD) selectively formed between the cell arrays and embedded in the substrate together with the cell array ; the embedded conductive lines (VSS, VDD) being selectively connected to the impurity introduction regions (l5, l7), and an insulating layer being formed on the embedded conductive lines, and wiring (l8) selectively connecting a plurality of cells being formed on the insulating layer.</p> |
