发明名称 MOLDING OF METALLIC PLATE EMBEDDED CASE
摘要 PURPOSE:To contrive the simplification and the cost down of the manufacture of a molding mold and eliminate the trace of a fixing pin on the case body by fixing a metallic plate, mounted in the molding mold, through the attraction of a magnet without using the fixing pin. CONSTITUTION:Under a condition that molds 10a, 10b are opened, the positioning hole 3 of a metallic plate 2 is fitted to a positioning pin 11a to position and mount the plate onto the molds 10a while this metallic plate 2 is attracted to magnets 13, 13 to fix it in the mold 10a. Under this condition, the molds 10a, 10b are closed and molding resin is injected into the molds 10a, 10b to mold a case body 1. According to this method, a metallic plate embedded case is molded. The metallic plate 2 is fixed by the attraction of the magnets 13, 13, provided on the mold 10a, without depending on a fixing pin, therefore, the provision of the fixing pin for fixing the metallic plate 2 to the molding molds 10a, 10b is not necessitated. On the other hand, the metallic plate 2 is attracted and fixed by the magnets 13, 13 provided in the mold 10a, therefore, the metallic plate 2 may be fixed surely upon mating the molds or injecting the molding resin so as not to be floated or slanted even when the fixing pin for fixing the metallic plate 2 is removed.
申请公布号 JPS62152824(A) 申请公布日期 1987.07.07
申请号 JP19850294001 申请日期 1985.12.27
申请人 CASIO COMPUT CO LTD 发明人 SUGIYAMA YOSHIMASA
分类号 B29C33/16;B29C45/14;B29C45/36 主分类号 B29C33/16
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