发明名称 METHOD FOR FIXING LEAD PIN IN CIRCUIT BOARD
摘要 PURPOSE:To accomplish automation and to improve work efficiency by a method wherein a lead line rolled in a ratchet is allowed to penetrate from above through a through-hole provided in a circuit board after passing through a guide hole provided in a guide jig, the tip of the lead line is placed in molten solder, the solder-coated portion is fixed secure in the through-hole, and the lead line is disconnected at a pint over the guide jig. CONSTITUTION:A lead line 7 is rolled on a revolution-capable ratchet 4 of a fixing unit A and its tip goes through a guide hole 1a of a guide jig 1 when a clamp 5 comes down. A circuit board 6 is so arranged that, between the guide jig 1 and a soldering bath 2, the center of a through-hole 8 may be positioned in line with the central axis of the guide hole 1a. Next, the lead line 7 now in the jig 1 is let through the through-hole 8 in the circuit board 6 for the immersion of the lead line 7 in molten solder 9 in the soldering bath 2. The clamp 5 goes up for the elevation of the lead line 7, the solder-coated portion 9a stops secure in the through-hole 8, and then a cutter 3 goes into action for the production a lead pin 11.
申请公布号 JPS62152152(A) 申请公布日期 1987.07.07
申请号 JP19850297586 申请日期 1985.12.25
申请人 TANAKA DENSHI KOGYO KK 发明人 ARAI HISAO
分类号 H01L23/50;H01L21/48;H05K3/30;H05K3/34 主分类号 H01L23/50
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