| 摘要 |
An apparatus for automatically mounting special-type chips on a substrate which is capable of individually and successively mounting special-type chips on a substrate at a high speed. The apparatus comprises a chip feed and removing mechanism for individually and successively feeding chips to a chip fitting mechanism, the chip fitting mechanism including a single mounting head and adapted to accurately position terminal pins of a chip with respect to a substrate, and a chip terminal clinching mechansim for cutting and bending the terminal pins to securely mount the chip on the substrate.
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