| 摘要 |
PURPOSE:To prevent a soldering failure and to simplify the structure of a device by forming a preheat section part between the cooling part of a carrying-in port part of a vapor tank, and the vapor tank. CONSTITUTION:The carrying-in port part 15 of a vapor tank 11 is made longer than a carrying-out port part 16, a cooling coil 18 is provided on a position separated enough from the vapor tank 11, and also a preheat section part 20 is formed between the cooling coil 18 and the vapor tank 11. When the board P loaded with parts is carried into the carrying-in port part 15 through a carrying conveyor 31, the board P and the loaded parts W are heated gradually by the vaporized latent heat of a vapor phase 21a flows out of the vapor tank 11, in the preheat section part 20 and enter into the vapor tank 11, and the loaded parts W are soldered by the vaporized latent heat of a vapor phase 21 of a solvent. According to this method, the sudden heating of the loaded parts W and an outbreak phenomenon are prevented. Accordingly, the soldering failure is prevented and also a device can be simplified. |
