发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:The titled composition, obtained by using tetraphenylborate of tri-p- tolylphosphine as a curing accelerator and novolak type phenolic resin as a curing agent and having improved molding operability, fluidity, curability and hardness. CONSTITUTION:An epoxy resin composition containing a novolak type phenolic resin, preferably 0.8-1.2, based on one epoxy group, phenolic groups as a curing agent and tetraphenylborate of tri-p-tolylphosphine expressed by the formula as a curing accelerator. The amount of the above-mentioned curing accelerator to be blended is preferably 2-3pts.wt. based on 100pts.wt. epoxy resin.
申请公布号 JPS62151420(A) 申请公布日期 1987.07.06
申请号 JP19850295797 申请日期 1985.12.26
申请人 HITACHI CHEM CO LTD 发明人 KINASHI KEIICHI;ICHIMURA SHIGEKI;KUBO ETSUJI
分类号 C08G59/00;C08G59/40;C08G59/62;C08G59/68;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
代理机构 代理人
主权项
地址