发明名称 FORMATION OF ELECTRODE AND APPARATUS FOR SAME
摘要 PURPOSE:To efficiently and inexpensively form electrodes such as bump electrodes by press-bonding a melted ball formed by heating one end of a wire, and disconnecting it from the wire. CONSTITUTION:The end of a wire 17 is melted by a discharge torch 20, and a melted ball 21 is formed. The ball 21 is bonded to a pad 13 by pressing while an ultrasonic vibration is being applied by a capillary 15. A clamper 10 clamps the mid portion of a wire 17 to rise together with the capillary 15. Thus, the wire 17 is disconnected from the room portion 21a of the ball 21 to form a bump electrode 22. Since an electrode material is sequentially supplied in a wire state to form the electrode 22, the electrode can be efficiently formed. Thus, the inexpensive bump electrode can be formed.
申请公布号 JPS62150854(A) 申请公布日期 1987.07.04
申请号 JP19850290641 申请日期 1985.12.25
申请人 HITACHI LTD 发明人 YAMAZAKI ISAMU
分类号 H01L21/28;H01L21/60 主分类号 H01L21/28
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