发明名称 ELECTRONIC DEVICE
摘要 PURPOSE:To improve moisture resistant properties by a method wherein after a metal coating film is applied to a lead frame, the parts of the coating film at least corresponding to outer edge parts of a package are compressed. CONSTITUTION:A lead frame 2 is formed solidly from a thin plate by a punch- press work and a 42-alloy thin plate is employed as its base material 6. A plated copper film 7 as a metal coating film is applied to the whole surface of the base material 6 and compressed parts 8 composed of compressed plated copper film are formed in respective outer leads 4A-4C. A pellet 9 is bonded on the plated copper film 7 of a collector post 5A and the respective one side ends of bonding wires 10 are bonded on the plated copper film 7 of an emitter post 5B and the plated copper film 7 of a base post 5B. Then, by bonding the respective other side ends of the wires 10 to electrode pads, the pellet 9 is electrically connected to the outer leads 4B and 4C.
申请公布号 JPS62150754(A) 申请公布日期 1987.07.04
申请号 JP19850290509 申请日期 1985.12.25
申请人 HITACHI LTD 发明人 ENOMOTO USUKE;ARAKI ISAO;HATORI KAZUO
分类号 H01L23/48;H01L23/495 主分类号 H01L23/48
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