| 摘要 |
PURPOSE:To reduce the number of the parts needed and to obtain a semiconductor laser diode device easy to automatically assemble by a method wherein a semiconductor laser diode chip and a photo diode are mounted on one lead in such a way that the mutual end surfaces are not in parallel and these are molded using a transparent synthetic resin material. CONSTITUTION:A semiconductor laser diode chip 13 and a photo diode 14 are mounted on one lead 10 in such a way that the mutual end surfaces are not in parallel, and at the same time, each electrode of these semiconductor laser diode chip 13 and photo diode 14 is independently connected to other leads, and, the semiconductor laser diode chip 13 and the photo diode 14 are molded with a transparent synthetic resin material 16 including part of each lead of these. What a required as the constituent parts are just three leads 10-12, the semiconductor laser diode chip 13, the photo diode 14 and the transparent synthetic resin material 16 to mold these. Thereby, the number of the parts needed can be done with an extremely small number and the whole device can be miniaturized, and in addition, the automatic assembly to perform by a mechanical device can be contrived because each constituent parts is a single parts and a handleable form.
|
