发明名称 BONDING APPARATUS
摘要 PURPOSE:To prevent a bonding error in a bonding apparatus by obtaining a displacement of a stage for supplying a material to be bonded and a bonding stage by an image of a visual unit such as a camera. CONSTITUTION:A stage 4 for supplying a pellet 1 and a bonding stage 5 for positioning a stem 2 are arranged at separate positions on a bed 3. A camera 7 recognizes the pellet 1 placed on a placing plate 6. A camera recognizes the stem 2 placed on a heat block 8. The actual position displacement of the pellet 1 and the stem 2 after bonding is obtained by the image of the camera 9 after bonding to be stored in a memory 16. A controller 14 reads out data regarding the past displacement of the memory 16, uses it as a correction value for the present bonding, operates a collet 12 and sets the optical distance A of both the cameras 7, 9 and the mechanical distance B of both the stages 4, 5 to A=B.
申请公布号 JPS62150835(A) 申请公布日期 1987.07.04
申请号 JP19850290679 申请日期 1985.12.25
申请人 HITACHI TOKYO ELECTRON CO LTD;HITACHI LTD 发明人 FURUHASHI TAKAHIRO;YAZAKI NORIHIRO;KANEKO FUJIKATSU;MATSUOKA KAZUHIKO
分类号 H01L21/52;H01L21/58 主分类号 H01L21/52
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