| 摘要 |
<p>PURPOSE:To make the height of a hybrid integrated circuit half of a conventional circuit, by coupling two separated metal substrates with an insulating film, providing pads, which are provided on the insulating film only on one metal substrate, and bending the insulating film. CONSTITUTION:Two separated metal substrates 11 and 12 are coupled with an insulating film 13. Conductor paths 14 having a desired shape are provided on the film 13. Pads 17 are provided at the end part of one metal substrate 12, to which the conductor paths 14 are extended. Circuit elements 15 are provided on the conductor paths 14. The film 13 between the substrates 11 and 12 is bent, and the opposite main surfaces of the substrates 11 and 12 are contacted. Thus, the height of the hybrid integrated circuit is made half that of a conventional circuit.</p> |
