| 摘要 |
PURPOSE:To deposit a flexible copper film by plating with a chemical copper plating soln. in a time corresponding to 1/5-1/6 of the conventional time by adding specified amounts of a nonionic surfactant and a surfactant contg. fluorine to the plating soln. CONSTITUTION:An aqueous soln. contg. a copper salt, a complexing agent, a reducing agent, a pH adjusting agent, a stabilizer and a surfactant is prepd. as a chemical copper plating soln. At this time, 1-50mg/l nonionic surfactant and 10-100mg/l surfactant contg. fluorine are added as the surfactant. A polyoxyethylene deriv. is preferably used as the nonionic surfactant and perfluoroalkylsulfonate or perfluoroalkylcarboxylate as the surfactant contg. fluorine. |
