发明名称 HOT PRESSURE-SENSITIVE ADHESIVE
摘要 PURPOSE:To obtain a hot pressure-sensitive adhesive which has small adhesive power at room temperature and reveals its power by heating at a low temperature for a short time, by incorporating a hot-melt resin into an acrylic graft polymer having a polymer of a high glass transition point on its side chain. CONSTITUTION:A graft polymer is prepared, which consists of a principal chain comprising a room-temperature self-adhesive copolymer composed of an acrylic ester having a 1-12C alkyl group (e.g., butyl acrylate) and an unsaturated carboxylic acid (e.g., acrylic acid), and a side chain comprising a polymer having a glass transition point of 70-150 deg.C (e.g., polymethyl methacrylate or polysty rene). A hot-melt resin is incorporated into this graft polymer to give an objec tive hot pressure-sensitive adhesive. The hot-melt resin preferably has a melting point of 70-200 deg.C, and the examples thereof include a phenolic resin, an epoxy resin, and a polyterpene resin.
申请公布号 JPS62149777(A) 申请公布日期 1987.07.03
申请号 JP19850296603 申请日期 1985.12.24
申请人 NITTO ELECTRIC IND CO LTD 发明人 ANDO MASAHIKO;SUNAKAWA MAKOTO
分类号 C08L51/00;C08L51/06;C09J151/00 主分类号 C08L51/00
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