| 摘要 |
PURPOSE:To improve reliability of etching, by utilizing a drop of resist produced by reaction heat at the time of etching and performing etching in which the etched material is made to taper. CONSTITUTION:An etched material 102 is formed on a wafer 101. A resist 103 is formed on the material 102. Patterning process is performed in the resist 103. With the patterning-made resist 103 as a mask, a drop of the resist 103 produced by reaction heat on etching is utilized to perform etching, in which the etched material 102 is made to taper. Hence, reliability of etching can be improved.
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