| 摘要 |
<p>PURPOSE:To enable to prepare countermeasure against multiple pins of an IC by providing leads also on the side of a PGA package, thereby improving the mounting density without altering the outer size. CONSTITUTION:An improved PGA package is formed of a ceramic base 201, leads 203, a side leads 204, and a cavity 202. For example, 12 rows of leads 204 are provided on the side of the package of 12X12 of three rows, thereby increasing 48 pins for a conventional PGA package.</p> |
