| 摘要 |
PURPOSE:The titled composition, obtained by using respectively an acid anhydride as a curing agent and specific imidazole compound as a curing accelerator and having low stress characteristic, improved water resistance, low-temperature curability and storage stability in insulating sealing, casting and impregnating of electrical and electronic parts. CONSTITUTION:A composition obtained by blending (A) 100pts.wt. epoxy resin with (B) preferably 80-120pts.wt. acid anhydride, e.g. hexahydrophthalic anhydride, etc., as a curing agent and (C) preferably 1-3pts.wt. imidazole compound expressed by the formula (n is 1-14; R1-R3 are H, alkyl or phenyl), e.g. adduct of 2,4-diamino-6{2'-methyl-imidazolyl-(1)'}ethyl-s-triazine with isocyanuric acid, etc., as a curing accelerator.
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