| 摘要 |
PURPOSE:To eliminate the potential difference between a cap consisting of an insulator deposited with a conductive material only on the inside surface and a pressure sensitive semiconductor element and to prevent the internal breakdown when a large potential difference arises from the outside of the sensor by using the above-mentioned cap. CONSTITUTION:The cap 20 made of ceramics is formed with a metallization film on the inside surface in order to electrically connect a bonding wire 18 and a lead pin 12. An aperture 201 thereof is disposed to face metallization films 1726 and 1720 and after a header 11 is fitted to the cap 20 in such a manner that the open end of the cap contacts a peripheral stepped part 173 of a terminal board 17, a soldering iron is inserted through the aperture 201 to solder the metallization films 1726 and 1720 and the metallization film 202 by which both are electrically connected and at the same time the cap is mechanically fixed. The potential difference between the metallization film 202 and the silicon substrate of the pressure sensitive semiconductor element 15 is eliminated.
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