发明名称 |
Method of quality testing an electrode layer on a semiconductor component |
摘要 |
<p>In a method of quality testing an electrode layer on a semiconductor component to which a contact wire is to be bonded, a ball made of a material which is identical or similar to the material of the contact wire is pressed against the electrode layer using a bonding capillary and the depth of the indentation produced in the electrode layer as a consequence of this pressure is measured.</p> |
申请公布号 |
DE3641688(A1) |
申请公布日期 |
1987.07.02 |
申请号 |
DE19863641688 |
申请日期 |
1986.12.06 |
申请人 |
MITSUBISHI DENKI K.K. |
发明人 |
MACHIDA,KAZUMICHI;HIROTA,JITSUHO |
分类号 |
G01N3/00;G01N3/42;H01L21/66;(IPC1-7):H01L21/66;B23K20/02;G01N3/40 |
主分类号 |
G01N3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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