发明名称 VAPOR REFLOW TYPE SOLDERING DEVICE
摘要 PURPOSE:To realize the reduction of a running cost, etc., by providing the liquid mist generating means of a low temperature heating medium on a carrying-out side carrying path, and also bringing the heating value of a heating medium which becomes a high temperature, to a heat recovery to preheating of an object to be treated. CONSTITUTION:A liquid mist generating means for cooling an object to be treated 13 which is soldered is constituted by providing an upper liquid nozzle 24 and a lower liquid nozzle 25, on the upper wall of a carrying-out side carrying path 3, and the lower wall, respectively. The object to be treated 13 which is soldered by the saturated vapor 12 of a heating medium in a vapor tank 1 is cooled by the liquid-shaped curtain of the nozzles 24, 25 of the carrying-out side carrying path 3. In this case, the heating medium which takes away heat from the object to be treated 13 is fed to the heat exchanger 19 of the air curtain device 15 of a carrying in side carrying path 2 and cooled. The saturated vapor 12 is sealed by the liquid-shaped curtain and the air curtain device 15, and its leakage to the outside is reduced. The consumption of an expensive heating medium is decreased, and the running cost is reduced and the safety can be improved.
申请公布号 JPS62148082(A) 申请公布日期 1987.07.02
申请号 JP19850287737 申请日期 1985.12.23
申请人 HITACHI TECHNO ENG CO LTD 发明人 SANKAI HARUO;YAMADA YUKIO;MUKAI NORIAKI;TAKAHASHI HIROSHI
分类号 H05K3/34;B23K1/015 主分类号 H05K3/34
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