| 摘要 |
<p>Apparatus for providing microelectronic, intra-chip and chip-to-chip interconnections in an ultra-dense integrated circuit configuration. A chip interface mesa and chip assembly (10) includes a mesa member (12) which has a top planar mesa surface (14) and side walls (16). The perimeter of mesa (12) has a plurality of notches (18) which are each coated with a conductive layer. The notches (18) are electrically coupled to a mesa interface conductive terminals (22) via conductive pathways (20). A semiconductor chip (24) having a top surface (25) bearing active circuitry may be bonded to the bottom of mesa member (12) with an epoxy adhesive. Each notch (18) is aligned with a corresponding conductive interface pad (28) on the top surface (25) of the chip (24). Droplets of solder (26) are placed upon the chip interface pads (28) and are mechanically and electrically coupled to mesa (12) through a conductive layer on each notch (18). The present invention totally eliminates undesirable and wasteful looped wirebonds and provides substantial increases in volume available for active circuitry per planar die area.</p> |
