| 摘要 |
PURPOSE:To obtain the titled composition of low thermal expansion coefficient, suitable for multi-layer printed wiring board for large-sized computer, etc., by blending, in the form of resin component, each specific unsaturated bisimide and diamine. CONSTITUTION:The objective composition can be obtained by blending, in the form of resin component, (A) an unsaturated bisimide in which at least unsaturated imide ring-contg. two fragments are connected in such a manner as to be placed at meta-site each other against one benzene ring [e.g. a compound of formula I (D is divalent group having C=C double bond; k and lare each integer >=0; A1 and A2 are each -CH2-, -CS-, etc.)] and (B) a diamine in which at least amino group-contg. two fragments are connected in such a manner as to be placed at meta-site each other against one benzene ring [e.g. a compound of formula II (m and n are each integer >=0; B1 and B2 are each -CH2-, -CS-, etc.)] in a molar ratio A/B pref. 1.7/1.0-3.5/1.0.
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