| 摘要 |
PURPOSE:To automate the wire bonding between a pressure sensitive semiconductor element and a terminal plate which is used for the electric connection between the lead pin and pressure sensitive semiconductor element, and to relieve stress originating from the heat of solder and prevent the gas seal part of the lead pin from damaging by arranging the terminal plate on a spacer across an elastic member. CONSTITUTION:Respective lead pins 12 are connected electrically to respective electrode pads on the pressure sensitive semiconductor element 15 through an electrode formed on a metallization film on the terminal plate 17 and a bonding wire 18, and the terminal plate 17 is arranged on an end surface of the spacer 16 across a spring 19. Thus, the terminal plate 17 is arranged on the spacer 16 across the spring 19, so even if there is slight variance in the position relation between bonding surfaces of the terminal plate 17 and pressure sensitive semiconductor terminal 15, the variance is absorbed by the deformation of the spring 19 to facilitate the automation of bonding, and the influence of stress due to heat in bonding is relieved.
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