发明名称 BONDING WIRE LIFT CORRECTING DEVICE
摘要 <p>PURPOSE:To automate a wire lift correction by providing bonding wire lifting means, a lifting means moving mechanism, and a lifting operation stop controller. CONSTITUTION:When a wire 33 having a burr necessary to be corrected in lifting is recognized in IC 32 by an external appearance inspection after bonding, a block 11 is moved by manipulators 19, 20 to the positions of an electrode pad 34 to be connected with the wire 33 and external lead 35. A microcomputer 28 calculates the positions of the pad 34 and the lead 35 and the gradient of a linear line for connecting between the two points on the basis of the moved distance to control pulse motors 12, 13, 10, 7, thereby moving an X-Y stage 14, a block 8 and an X-Y stage 6. Thus, the wire lifting can be automatially corrected.</p>
申请公布号 JPS62147739(A) 申请公布日期 1987.07.01
申请号 JP19850288784 申请日期 1985.12.20
申请人 NEC CORP 发明人 TAKEI KATSUO
分类号 H01L21/60 主分类号 H01L21/60
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