| 摘要 |
PURPOSE:To enhance the mounting density and the number of lead pins of a semiconductor device by resin-sealing the device without extending leads externally of a resin sealer, and then forming holes from the lower sealer to the inner leads. CONSTITUTION:The outer end sides of many leads 2 connected by fine metal wirings 5 with a semiconductor element 4 placed on a semiconductor element placing unit 1 are not externally exposed from the end of a resin sealer 6 to eliminate external leads. Insteads, small holes 7 communicating with the leads 2 from arbitrary positions on the lower surface of the sealer 6 are opened at every lead. Accordingly, the leads and the external conductors can be connected by solder dipping by filling flux in the holes. Thus, since high density mounting is performed and the holes on the lower surface of the sealer may be small, more pins of the leads than the conventional one can be provided in the same package size. |
