| 摘要 |
<p>The process, for use in mfr. of integrated electronic circuits, consists of (a) anchoring by treating the Al in an aq. bath contg. Zn, Ni and similar salts, in NaOH to remove the oxide layer; (b) partially removing the anchor coat in a 50% nitric acid bath and applying a new anchor coat to reduce and give continuity to the metal layer deposited on the surface; (c) electroplating with Ag or Au; and (d) heating in an oven to cause welding by diffusion of the gold or silver and the Al.</p> |
