发明名称 Multiple lead probe for integrated circuits.
摘要 <p>A probe assembly for use in testing an integrated circuit embodied in an integrated circuit chip, comprises a stiff support member formed with an aperture, and an elastically-deformable membrane. Both the support member and the membrane comprise dielectric material and portions of conductive material supported by the dielectric material in electrically-insulated relationship. The portions of conductive material of the membrane constitute inner contact elements distributed over a face of the membrane in a pattern that corresponds to the pattern in which contact areas are distributed over the contact face of the chip under test, outer contact elements exposed about a peripheral region of the membrane in a second pattern, and transmission lines extending from the inner contact elements to the outer contact elements respectively. The portions of conductive material of the support member comprise inner contact elements exposed in a pattern corresponding to the second pattern, and transmission lines extending from the inner contact elements of the support member for connection to testing apparatus. The membrane is secured to the support member in a manner such that the membrane overlies the aperture in the support member and the outer contact elements of the membrane are in electrically-conductive contact with respective inner contact elements of the support member.</p>
申请公布号 EP0226995(A2) 申请公布日期 1987.07.01
申请号 EP19860117418 申请日期 1986.12.15
申请人 TEKTRONIX, INC. 发明人 GARUTS, VALDIS E.;CREEDON, THEODORE G.
分类号 G01R31/26;G01R1/073;(IPC1-7):G01R1/073 主分类号 G01R31/26
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