Lead wire soldering apparatus.

摘要

A lead wire tinning apparatus comprises a solder wave station which includes a vertical chimney (50) for the upward flow of molten solder (38') and a cover plate (60) for reducing the opening of said chimney in moving direction of components (11) having said lead wires (12, 13). By said cover plate (60) the cross-sectional area of a convex solder wave configuration (61, 62) is reduced (Fig. 5).