| 摘要 |
PURPOSE:To prevent wirings in a connecting portion of photoresist patterns from being disconnected by providing the steps of exposing with a first mask, and exposing by superposing part of a second mask on a first photoresist pattern. CONSTITUTION:When a photoresist pattern is formed on a unit chip 11 on a wafer 12, a plurality of mask are used to form patterns by dividing by a plurality of exposing steps. At this time the first mask is used to expose to form the connecting portion of the first photoresist pattern 14 widely, the second mask is used to superpose part of the second mask on the first photoresist pattern in the exposing step, and part of the second photoresist pattern 15 is continued to the connecting portion 14A of the first pattern. Thus, even if a small displacement of the photomask occurs, the disconnection of the formed pattern at the connecting portion can be avoided.
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